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"Universal chip" FPGA has always existed firmly
Samsung Semiconductor shares storage solutions in the era of artificial intelligence and big data at ODCC2023
STMicroelectronics’ low-temperature drift, high-accuracy op amp increases operating temperature to 175°C
Toshiba further expands Thermoflagger™ product line – a simple solution for detecting temperature rise in electronic devices
Intel launches Thunderbolt 5 connection standard: bandwidth up to 120Gbps, three times higher than the best existing solution
Inventec and Renesas Electronics jointly develop automotive gateway proof-of-concept product
Dalian Shiping Group launches permanent magnet synchronous motor drive solution based on NXP products
STMicroelectronics' Location-Aware Mobile Network IoT Module Receives Vodafone NB-IoT Certification
Vishay Introduces Tiny Infrared Sensor Module with Modulated Carrier Output for Code Learning Applications
Toshiba Develops Industry's First 2200V Dual SiC MOSFET Module, Contributing to High Efficiency and Miniaturization of Industrial Equipment
STMicroelectronics STM32 fully supports Microsoft Visual Studio Code
Samsung releases its largest capacity 12nm-class 32Gb DDR5 DRAM product
Vishay Introduces Thick Film Power Resistors with Optional NTC Thermistor and PC-TIM to Simplify Design, Save Board Space and Reduce Cost
ROHM Develops Thermal Printhead with Industry's Fastest Printing Speed of 500mm/sec for Barcode Label Printing Applications
STMicroelectronics launches STM32 programming debugger with extended power range, enabling next-generation ultra-low power applications
STMicroelectronics launches STM32 programming debugger with extended power range, enabling next-generation ultra-low power applications
STMicroelectronics launches STM32 programming debugger with extended power range, enabling next-generation ultra-low power applications
NXP Introduces Next-Generation Secure, Power-Efficient i.MX 91 Family, Extending Linux Capabilities for a Wide Range of Edge Applications
Samsung's new Sensor OLED, the first panel with built-in fingerprint and heart rate sensors
Toshiba's New Digital Isolator Enables Stable High-Speed Isolated Data Transmission for Industrial Applications
STMicroelectronics ST-ONE series USD PD controller power increased to 140W
"1.8nm" process has no opponents, Intel chip foundry wins MediaTek: mass production in 2025
Silicon Labs Announces the Launch of Next-Generation and Third-Generation Wireless Development Platforms
Texas Instruments Introduces New High-Precision Hall-Effect Sensor and Integrated Shunt to Simplify Current Sensing
New progress in large-area perovskite solar energy: Toshiba's 703 cm2 module achieves 16.6% efficiency
Silicon Labs Accelerates Sidewalk Networking Adoption with New SoC and Development Tools Optimized for Amazon Sidewalk
Microchip Introduces LAN9662, New Gigabit Ethernet Switch for Industrial Automation
Intel Ruixuan Graphics DX11 performance update, and launched a new Intel PresentMon\xa0Beta
NXP continues to innovate to improve the positioning accuracy of ultra-wideband (UWB) technology to millimeter level
Lattice FPGAs Power Wind Energy for a Sustainable, Connected World
Toshiba Launches Small Photorelays with High-Speed Turn-On Contribute to Shorter Test Times for Semiconductor Test Equipment
STMicroelectronics releases 100V industrial-grade STripFET F8 transistor with 40% higher figure of merit
Diodes Incorporated High Efficiency Buck Converters Offer Various POL Design Diversity
ON Semiconductor's Next-Generation 1200 V EliteSiC M3S Devices Improve Energy Efficiency in Electric Vehicle and Energy Infrastructure
STMicroelectronics' USB-powered EPR overall solution has been certified by USB-IF, and the output power of a single power adapter is up to 140W
Diodes Incorporated Introduces Space-Saving TVS with Superior ESD and Surge Protection for High-Speed I/O
Samsung announced that it would abandon Android and compete with Huawei Hongmeng, which caused a shock in the global technology community
Intel teamed up with Synopsys, a major EDA manufacturer, to promote the implementation of Intel 3/Intel 18A process
Toshiba Launches Automotive 40V N-Channel Power MOSFET in New Package Contributing to High Heat Dissipation of Automotive Equipment
New Opportunities for RISC-V Automotive Electronics
UK in talks with Nvidia, AMD, Intel and more to buy AI chips
The global consumer electronics market will exceed US$1 trillion in 2021, and the CAGR is expected to exceed 8% from 2021 to 2027
Samsung Display, LGD's MicroOLED, MicroLED Technology Investment Layout
STMicroelectronics' first dual op amp for electric vehicle resolver
Automotive MCU is still booming
Infineon uses recyclable printed circuit boards from Jiva Materials
Summary of 2023 Q2 financial reports of many major chip manufacturers (3)
Intel may abandon acquisition of TowerSEMI, pay $353 million termination fee
Summary of 2023 Q2 financial reports of many major chip manufacturers (2)
WP World Peace Group launched a computer case fan lighting control solution based on NXP products
STMicroelectronics Introduces Hot-Switch Ideal Diode Controller for ASIL-D Automotive Safety-Critical Applications
Intel’s advanced manufacturing process has suffered another setback, Ming-Chi Kuo said that Qualcomm has stopped developing Intel 20A chips
Summary of 2023 Q2 financial reports of many major chip manufacturers（1）
Samsung Electronics discloses BSPDN (Backside Power Supply Network) research results for the first time
Allegro acquires TMR magnetic sensor developer Crocus Technology for $420 million
Vishay Introduces New High-Performance Reflective Light Sensors Based on VCSELs
ROHM Adds 5 New 100V Voltage-resistant Dual MOSFETs with 5.0mm×6.0mm and 3.3mm×3.3mm Sizes to Achieve the Industry’s Ultra-Low On-Resistance
Major companies such as Micron, Intel, and UMC have collectively rushed into Singapore
Technical advantages of ON Semiconductor's new ElitePower simulation tool and PLECS model self-service generation tool
Renesas acquires cellular IoT chip maker Sequans for $249 million
Infineon expands 1200 V 62 mm IGBT7 portfolio with new current rating modules
Renesas MCUs and MPUs will support Microsoft Visual Studio Code
Intel driver starts to collect data by default
Toshiba Launches World's First Real-Time CO2 Emissions Measurement Technology: 1.7 Seconds, 150 Times Faster than Ever
GlobalFoundries Acquires Renesas Non-Volatile Resistive RAM Technology, Strengthening Memory Portfolio
STMicroelectronics mass-produces PowerGaN devices, making power products smaller, cooler, and more energy-efficient
Russia's 'Baikal' benchmark compares Intel and Huawei chips
WP World Peace Group launched an electric vehicle charging pile solution based on onsemi products
STMicroelectronics Introduces Innovative Infrared Sensor to Improve Presence and Movement Detection in Building Automation
Intel Completes the Allocation of USD 425 Million in Green Bond Proceeds, Continuing to Strengthen Sustainable Development
Infineon announced to build the world's largest SIC factory in Malaysia
Qualcomm and NXP and other major chip manufacturers promote RISC-V automotive chips
Rutronik exhibited a variety of latest solutions from Infineon, providing customers with highly competitive application advantages in the market
Toshiba Launches "TXZ+ Family Advanced Series" ARM Cortex-M3 Microcontroller
STMicroelectronics Simplifies and Accelerates Wireless Product Development with STM32WB1MMC Bluetooth® LE Certified Module
STMicroelectronics STM32 USB PD MCU now supports UCSI specification, accelerating the widespread adoption of Type-C power supply
STMicroelectronics STM32 USB PD MCU now supports UCSI specification, accelerating the widespread adoption of Type-C power supply
Dapuwei announces mass production of enterprise PCIe 5.0 SSD equipped with Marvell Bravera™ SC5 master control
Infineon launches biodegradable PCB substrate
Intel promotes the deployment of optimized solutions for the smart education industry
ON Semiconductor's silicon carbide revenue increased nearly 4 times year-on-year
Micron announced that it has sampled the industry's first HBM3 Gen2 memory
ROHM Develops VCSEL-equipped Compact Proximity Sensor "RPR-0720"
TI's innovative wireless MCU solution helps users accelerate the embrace of the Internet of Things
Toshiba Introduces Miniaturized Ultra-Thin Package Common-Drain MOSFET with Lower On-Resistance for Fast-Charging Devices
Renesas Electronics Introduces 10 New Portfolio of Successful Products Including Automotive Grade
Intel completes the installation of the Aurora supercomputer, which will become the world's first supercomputer with 20 billion calculations per second
Allegro MicroSystems Introduces First ASIL C Safety-Rated Magnetic Field Current Sensor for Electric Vehicle Powertrains
Microchip Expands Portfolio of Safety-Authenticated ICs
Toshiba Launches Thermoflagger, a Simple Solution for Detecting Temperature Rise in Electronic Devices
ON Semiconductor and Magna Sign Strategic Partnership Agreement to Invest in Silicon Carbide Production to Meet Growing Electric Vehicle Market Demand
ON Semiconductor and Magna Sign Strategic Partnership Agreement to Invest in Silicon Carbide Production to Meet Growing Electric Vehicle Market Demand
MaxLinear Terminates Acquisition of Silicon Motion
Micron Introduces Higher-Performance High-Capacity, High-Bandwidth Memory to Fuel Generative AI Innovation
Intel AI Reference Kit Helps Enterprises Run AI Workloads Efficiently
Infineon Launches SECORA™ Pay Portfolio with 28nm Chip Technology
Samsung's own chips are back: news that the European versions of the Galaxy S23 FE and S24 series will be equipped with Exynos processors
NXP's Q2 revenue is 3.3 billion, of which the sales volume of automotive chips is the highest
Consolidating MCU Advantages with Solutions Renesas Embraces Arm Automotive Ecosystem
Infineon Launches Two New XENSIV™ Air Pressure Sensors for Engine Management and Pneumatic Seating Systems
Intel AI software and hardware work together to provide acceleration for the Llama 2 model
Renesas Electronics Automotive-Grade MCU and SoC Cybersecurity Management Certified to ISO/SAE 21434:2021
ON Semiconductor Expands Bluetooth Low Energy Microcontroller (MCU) Family to Automotive Wireless Applications
20Gbps 2x2 switching switcher from Diodes Incorporated enables fast multitasking/switching for automotive media and driver assistance systems
STMicroelectronics Introduces Second-Generation Industry 4.0 Edge AI Microprocessor
Texas Instruments Introduces New Family of Vision Processors to Enable Scalable Edge AI Performance in Smart Camera Applications
Samsung launches its first GDDR7, which will further strengthen the application capabilities of AI, high-performance computing and automobiles
ON Semiconductor and BorgWarner Expand Silicon Carbide Strategic Cooperation, the Total Agreement Value Exceeds $1 Billion
An update a year after Renesas acquired Reality AI
STMicroelectronics' automotive-grade micro-power op amp withstands harsh temperatures and prolongs service life
Microchip Introduces Silicon Carbon Electronic Fuse Handout Board
Infineon and Semikron Danfoss sign supply agreement for electric vehicle chips
Intel's second-generation Core CPU rose 21%, and the core display soared 2.4 times
Samsung Display develops MicroLED microdisplay technology for AR
Texas Instruments Introduces Silicon Carbide Gate Drivers to Maximize Electric Vehicle Range
Texas Instruments Introduces Silicon Carbide Gate Drivers to Maximize Electric Vehicle Range
Silicon Labs Announces New Bluetooth SoC for Extremely Small Devices
ON Semiconductor Introduces New Hyperlux Image Sensor Family, Leading the Development of Next-Generation Advanced Driver Assistance Systems to Improve
Texas Instruments Enables More Robust, More Affordable Wi-Fi® Technology for Connected IoT Applications
Microchip Introduces Automotive-Grade 10BASE-T1S Demolition Scrap
Teledyne e2v and Infineon Partner to Provide Processor Boot Optimization for Edge Computing Space Systems
STMicroelectronics Introduces Industry's First MEMS Waterproof Pressure Sensor
Micron to launch GDDR7 in 2024, AMD RX 8000 series may be launched first
Renesas Electronics Selects Altium to Unify PCB Development Tools and Accelerate Solution Design for Partners and Customers
STMicroelectronics releases galvanically isolated high-side switch with diagnostic control and protection for industrial loads
Renesas Electronics Introduces R-Car S4 Starter Kit for Rapid Software Development of Automotive Gateway Systems
Nexperia launches new 600V single-transistor IGBT for outstanding efficiency in power applications
STMicroelectronics releases 100V industrial-grade STripFET F8 transistor with 40% higher figure of merit
Microchip Releases New Long-Range USB 3.2 Reclocker/Signal Repeater Device for Automotive and Industrial Applications
Samsung SDI produces 46120 batteries
Toshiba's 100V N-channel power MOSFET contributes to the miniaturization of power supply circuits
Vishay Introduces New 60V, 100V and 150V Rectifiers Rated up to 7A
Onsemi M3S EliteSiC MOSFET allows car charger to upgrade to 800V battery architecture
Intel Prepares Z890 Motherboard Chipset for Arrow Lake-S and Raptor Lake Refresh
STMicroelectronics Introduces VL53L7CX Multi-Region ToF Ranging Sensor with Camera-like Field of View
Broadcom invests $1 billion in chip plan
Broadcom invests $1 billion in chip plan
Infineon launches new generation of dual-channel isolated gate driver ICs to boost system performance in SMPS designs
Indian semiconductor industry remains dormant
Intel promotes the integration of edge computing and artificial intelligence to help innovation and development in the digital age
Element14 will join hands with ADI to appear at the 2023 Munich Shanghai Electronics Fair
Samsung's profit plummeted 96%, hitting a 14-year low
Renesas signs 10-year wafer supply agreement with Wolfspeed
The latest information of chip manufacturers (3)
Micron Technology's Q3 net loss of US$1.9 billion in fiscal year 2023
Intel Selected for COOLERCHIPS Program, Committed to Creating New Cooling Technologies for Future Data Centers
Infineon's CoolSiC™ XHP™2 high-power modules help drive decarbonization of energy-efficient electrified trains
Infineon's CoolSiC™ XHP™2 high-power modules help drive decarbonization of energy-efficient electrified trains
The latest information of chip manufacturers (2)
ROHM's New High-Voltage Hall IC Series Makes Your Automotive Applications Even More Powerful
Samsung Foundry Strengthens Partnerships with Major EDA Companies
Microchip Launches Multi-Year $300 Million Investment Plan to Expand Presence in India
The latest information of chip manufacturers (1)
Renesas launched more than 35 new MCU products, motor control embedded processing expansion
IAR fully supports Infineon's latest TRAVEO T2G CYT6BJ body control MCU family products
ADI and Marvell Demonstrate 5G Massive MIMO RF Unit Platform
Infineon's HYPERRAM 3.0 memory chip is paired with the third-generation chipset of Autotalks to enable automotive V2X applications
FPGAs shine in the embedded world
Micron Forecast: Chip Surplus Is Easing
New Dual-Band SoC Extends Connectivity Range for Amazon Sidewalk, Wi-SUN and Proprietary Long-Range Wireless Protocols
Vishay's new infrared sensor provides stable ranging in direct sunlight
Silicon Labs Boston Office Opens New Connectivity Lab, Ecosystem and Developers Come Together to Celebrate
ON Semiconductor Introduces End-to-End Positioning System for More Power-Efficient, High-Precision Asset Tracking
Japanese technology giants have made efforts to improve 2nm chip technology
Infineon: Semiconductors enable intelligent driving and the evolution of vehicle electrical and electronic architecture
STMicroelectronics Introduces Integrated Hot-Swap and Ideal Diode Controller for Automotive Safety-Critical Applications
EU Commissioner Emphasizes: Europe must focus on cutting-edge chip manufacturing and lead the development of chip manufacturing
Intel enters quantum computing with 12-qubit QPU
Intel enters quantum computing with 12-qubit QPU
Samsung is speeding up production of AI-oriented HBM memory chips to compete with SK Hynix and TSMC
Samsung Electronics, SK Hynix will still lose money in the second quarter due to weak chip demand
A delegation of ON Semiconductor executives visited Inovance Technology
Airbus and STMicroelectronics team up to develop aircraft power electronics components
AMD Invests $135M to Expand Xilinx FPGA Development in Ireland
Micron launches its first UFS 4.0 product with sequential read and write up to 4,300 MB/s, 4,000 MB/s
Infineon considers shifting more chip capacity to US
Samsung announces Exynos Auto V920 chip specifications: Xclipse GPU with integrated RDNA 2 architecture
Intel will sell half of its chipmaking unit in two years, saving up to $10 billion in costs
With a total investment of 22.6 billion yuan, Texas Instruments Semiconductor Factory plans to build 2 new factories
Microchip's Power over Ethernet Solves Powering Problems for Wireless Applications
Which countries can really benefit from EU subsidies?
US semiconductor company Micron may go to India to invest 1 billion US dollars to build a factory
Broadcom launches second-generation Wi-Fi 7 solution with transmission speeds up to 8.64 Gbps
Memory chip manufacturers start a new round of process competition
Intel Releases New Silicon Spin Qubit Chip
ROHM develops RGB SMD LEDs for automotive interiors to reduce chromatic aberration caused by color mixing
Intel plans to invest $4.6 billion in a semiconductor assembly and testing plant in Poland
NXP introduces new top-cooled packaging technology for RF power devices to further reduce the size of 5G wireless products
Infineon Releases ModusToolbox™ 3.1 to Accelerate Embedded Development
Infineon AURIX and TRAVEO microcontrollers support IEC 61508 software
Winbond Electronics Launches Next-Generation 8Mb Serial NOR Flash for Space-Constrained IoT Edge Devices
Building the Future of Embedded Processing Together, Texas Instruments Appears at Shanghai International Embedded Expo
Toshiba Introduces Small Package Motor Driver IC with Fewer External Parts, Saving Board Space
EU approves 21 billion euro IPCEI project, beneficiaries include Infineon, Bosch and Zeiss
Nexperia | Expands Portfolio of ESD Protection Solutions for Automotive Ethernet
Weak demand for analog chips
Microchip Expands Radiation-Tolerant Gigabit Ethernet PHY Lineup with New VSC8574RTPHY Device
Nexperia Launches E-mode GAN FETs Supporting Low-Voltage and High-Voltage Applications
Infineon boosts high-power systems with new EiceDRIVER 1200 V half-bridge driver IC family
How long can automotive MCU chips be "short"?
Broadcom's acquisition of VMware will receive conditional EU approval
EU wholesales 8.1 billion euros in public funds to support chip research and development
ROHM begins mass production of 650V withstand voltage GaNHEMT with industry's highest performance
NIO and NXP launch 4D imaging radar cooperation
The latest market quotations of major chip manufacturers (3)
Renesas and Nidec to Collaborate on Semiconductor Solutions for Next-Generation Electric Vehicle E-Axle
Ubuntu Now Supports Running on AMD-Xilinx Versal Adaptive SoC Evaluation Kit
The latest market quotations of major chip manufacturers (2)
Microchip Releases Upgraded Programmer and Debugger Development Tools
The latest market quotations of major chip manufacturers (1)
Texas Instruments held lectures on new energy topics in Wuhan and Xi'an by technical experts in colleges and universities
STMicroelectronics and Sanan Optoelectronics plan to set up a factory in Chongqing to produce key components for electric vehicles
Microchip recently announced the launch of new development resources and design services
Renesas Electronics Successfully Completes the Acquisition of Panthronics AG on June 2, 2023
Samsung launches Exynos Auto V920 automotive chip: CPU performance is 1.7 times that of the previous generation
Vitesco Technology and ON Semiconductor signed a long-term silicon carbide supply agreement to jointly invest in silicon carbide production expansion
Japan vigorously develops semiconductors, subsidizes Micron, and introduces EUV lithography machines
Japan vigorously develops semiconductors, subsidizes Micron, and introduces EUV lithography machines
STMicroelectronics Releases Intelligent Sensor Processor Programming Toolchain and Supporting Software Package
Intel announces its PowerVia technology for backside power delivery
Infineon product defect delays IONIQ 5 delivery by more than a year
Intel opens chip research facility in Seoul, South Korea
Broadcom is likely to be another company after Nvidia that benefits from the need for AI infrastructure
Intel, which has been left behind by competitors such as Nvidia, will reverse the company's fortunes through large-scale factory expansion
Power semiconductors enter the SiC era
Samsung Electronics mass-produces the world's first 12nm-class DRAM
Nexperia: Total revenue will reach US$2.36 billion in 2022, a year-on-year increase of 10.7%
Broadcom proposes antitrust pledge to EU to facilitate clearance of $61 billion VMware acquisition
Samsung Semiconductor will reduce the amount of wafers put into wafers by 10%, and the EUV production line will be even worse
The demand in the new energy market is hot, and semiconductor giants gather in GaN
The demand in the new energy market is hot, and semiconductor giants gather in GaN
STMicroelectronics and other European companies join Apple's clean energy plan
After Micron, the second largest memory chip maker in the United States will merge with a Japanese company
Daily Semiconductor Industry Infomation Collected By Lansheng Technology
Daily Semiconductor Industry Inforamation Collected By Lansheng Technology
Daily Semiconductor Industry Inforamation Collected By Lansheng Technology
Japan invites semiconductor giants to talk about what results can "Chip 4" gather in Japan?
Daily Semiconductor Industry Information Collected By Lansheng Technology
Daily Semiconductor Industry Information By Lansheng Technology
Daily Semiconductor Industry Information Collected By Lansheng Technology
Major international semiconductor manufacturers are aggressively deploying in Malaysia
Major semiconductor manufacturers are actively deploying the automotive SiC market
Daily Semiconductor Industry Information Collected By Lansheng Technology
GlobalFoundries' Q1 automotive chip revenue soared 122%! However, the Q2 financial forecast was lower than expected, and the stock price fell by 9%
Daily Semiconductor Industry Information Colltected By Lansheng Technology
Dynamic Analysis of Semiconductor Industry (2)
Daily Semicondutor Industry Information Collected By Lansheng Technology
These are Dynamic Analysis of Power and Storage Semiconductor Industry, we will collect more Dynamic Analysis of Semiconductor Industry, if you are interested in, please follow us—Lansheng Technology
These are some semiconductor information of #Intel, #TSMC, #Micon
Intel shock chip manufacturing center, and TSMC is involved
Daily Semiconductor Information Collected By Lansheng Technology
Daily Semiconductor Information Collected By Lansheng Technology
The United States strongly stimulates China's semiconductor industry, and South Korean companies are forced to set up factories in the U.S.
The United States strongly stimulates China's semiconductor industry, and South Korean companies are forced to set up factories in the U.S.
The global automotive semiconductor sensor market will reach $14 billion in 2028
The global automotive semiconductor sensor market will reach $14 billion in 2028
The latest chip industry information collected by Lansheng Technology
The Latest Chip Market Information of Broadcom, Renesas, ON Semiconductor By Lansheng Technology
Daily Semiconductor Information By Lansheng Technology
The Latest Chip Market Information About ADI, Microchip, XILINX By Lansheng Technology
Semiconductor wafer companies such as Shanghai Supersilicon are favored by global manufacturers
Daily Semiconductor Industry Information By Lansheng Technology
TSMC's US-made chips are expensive, and US customers are considering switching to Samsung and Intel
Russia announced to vigorously develop the semiconductor industry
The Latest Chip Market Information About TI, ST, NXP By Lansheng Technology
Daily Semiconductor Industry Information By Lansheng Technology
Daily Semiconductor Information By Lansheng Technology
Daily Semiconductor Industry Information By Lansheng Technology
Daily Semiconductor Industry Information By Lansheng Technology
In this article you'll get to know about the features of an upcoming IPhone SE 3.
Asus India's new VivoBook 13 Slate 13.3-inch OLED Laptop will definitely blow your mind. To know more about the laptop read this article.
Besides European governments, Big tech firms are also angered by the Russian government's actions against Ukraine.
Over 10,000 mobile users have been updated with the new malware dubbed "Teabot" that was discovered online.
Over 10,000 mobile users have been updated with the new malware dubbed "Teabot" that was discovered online.
Nvidia, a California-based tech firm, recently became the target of a huge cyber-attack.
The chip market has seen a 5% rise amid the Russia-Ukraine War.
Facebook took a major step to prevent Russian State Media from gaining profit.
Google is unhappy with green Text Messages.
Whatsapp will soon roll out a new feature for Android users.
Google confirmed to soon roll out a new feature to help you connect Android phone and Windows PC to perform more tasks.
Indian IT Minister Ashwini Vaishnav welcomed Intel in India. Read further to know more.
Apple releases the limited edition of Beats Studio Buds. Read the complete article to know the specifics.
Motorola will soon add a new Razr foldable smartphone to its lineup of foldable phones.
Apple is planning to release Intel-powered Macs in future. Read the complete article to know more.
Pixel watch will soon add next-generation Google Assistant, Exynos chip functionalities.
Hyundai is all set to represent its robotics-based transportation aspiration at the CES convention.
Microsoft is planning to switch the Windows terminal to the default interface on Windows 11.
Google announced to release android games for Windows PC by 2022.
Soon anybody can unlock hotel rooms using a digital key card.
It is full of opportunities and often attracts people from different backgrounds. In this article, we discuss the things you need to know if you're interested in working in tech, and provide tips to help you find tech jobs.
China witnessed a 3% surge in PC shipments to over 15 million units.
New details about IPhone 14 have been disclosed, do read the article to know more.
Zoom plans to offer automatic updates to its users.
Tesla may manufacture 30,000 H1 vehicles at it's Gigafactory in Berlin.
Instagram is giving bonus to the content creators for posting reels. To know more read the article below.
Elon musk has no obligation to the employees listening to music at the workplace.
Microsoft promises to improve the performance of Windows 11, know why.
Telegram announced the launch of a "sponsored messages" feature. Read the complete article to know the benefits of this feature.
In this article you'll learn about the features that the new Jiobook laptop will include.
Due to the shortage of chips, Apple reduced the production of iPads.
Google added a new update to its video conferencing app Google meet, read the news to know more about it.
Bidden administration has shown concern regarding harmful uses of Artificial Intelligence, read the article to more about the matter
Discover all the details regarding the upcoming Nokia T20 tablet and G50 smartphone in this article.
Tech giant Google recently took a crucial step by banning eight fake apps from its app store.
Zoom added a new feature "Focus Mode" to help the host to keep their participants engaged while explaining something important.
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Flipkart has launched a new Feature AI-powered feature "Flipkart Camera" to improve the shopping experience on its platform.
TutorialsLink Tech Community Impact Award
TutorialsLink Tech Community Impact Award | TutorialsLink Community
Amazon Alexa will possess this new skill which will monitor its surroundings for signs of a heart attack and call for help
The client stay away for the indefinite future back baffled once they approach the specialized group for their issues to be replied and afterward to be viably given an answer. The specialized group tends to address enormous mass of clients in a single day as they are open constantly.
Noah electric city car is built by students from TU Eindhoven University of Technology and is made out of biocomposite with flax and sugar being the main component.
Know why Google engineers denied building security tools to win military contracts
World Economic Forum (WEF) features two Indian startups in the list of 'Technology Pioneers'
Stack Overflow has released its much-anticipated Developer Survey 2017. Stack Overflow is conducting this survey each year. This year’s survey is the biggest in Stack Overflow’s history with 64,000 developers taking part.
