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Major international semiconductor manufacturers are aggressively deploying in Malaysia

Major international semiconductor manufacturers are aggressively deploying in Malaysia

 

#Semiconductor Southeast Asia 2023 will be held in Penang, #Malaysia on May 23. According to reports, packaging and testing in Malaysia accounts for 13% of the global market, and Penang is an important center for semiconductor packaging in the country.

 

According to the Taiwan #Electronic Equipment Association, the first semiconductor equipment inspection team was organized to visit the exhibition in Malaysia, mainly to help Taiwanese manufacturers respond to the global geopolitical supply chain transfer trend and expand the market for semiconductors, electronic equipment and intelligent manufacturing systems.

 

It is understood that since the Sino-US trade war, Malaysia's status has been further valued, and international semiconductor manufacturers have entered the country to invest and set up factories.

 

In 2022, European automotive chip manufacturer Infineon announced the construction of a third production line in Malaysia. Austrian AT&S is also producing carrier boards in Malaysia, which is the first expansion in Asia.

 

At the beginning of this year, Intel reiterated that it will invest US$6 billion in Malaysia to increase advanced packaging capabilities in Penang and Kulim, Kedah. At the same time, Intel also plans to invest an additional US$1 billion in Malaysia and Vietnam.

 

In addition, ASE, the leader in packaging and testing, has also significantly increased its stake in Malaysia. Originally, ASE’s Malaysian factory provided automotive electronics packaging and testing services. In the future, it will provide image sensor packaging services. ASE plans to invest US$300 million within five years to purchase advanced equipment and expand the scale of the plant.

 

According to Taiwan media reports, in October last year, Wang Shoutai, chairman of the Malaysian Semiconductor Industry Association, said that the passage of the "Chip Act" in the United States has allowed the United States to increase a large number of advanced process fabs, but the United States has insufficient packaging resources, and Malaysia is one of the few that can provide this service. Malaysia will also be a beneficiary when a large number of fabs in the United States are released.

 

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