Samsung is speeding up production of AI-oriented HBM memory chips to compete with SK Hynix and TSMC

Lansheng Technology News on June 27, in May this year, Kye Hyun Kyung, president of Samsung’s device solutions department, admitted that Samsung’s foundry technology lags behind TSMC. He also said that Samsung will overtake TSMC within five years. Now there is news that Samsung is preparing to mass-produce high-bandwidth memory chips for AI applications this year.

According to KoreaTimes, Samsung plans to mass-produce AI-oriented HBM chips in the second half of 2023, and at present, their main goal is to catch up with SK Hynix, which has quickly gained a leading position in the AI memory chip market.

SK Hynix has about 50% of the HBM market in 2022, while Samsung has about 40%. Micron holds the remaining 10%. However, the HBM market as a whole is not large, accounting for only about 1% of the entire DRAM market.

Nonetheless, as the AI market grows, demand for HBM solutions is expected to increase, and Samsung now plans to catch up with SK Hynix and mass-produce HBM3 chips in response to changes in the market, where AI-applied memory chips are becoming more prevalent, And high-bandwidth storage solutions are getting more and more attention.

Samsung, which has won AMD and Google as its customers, will manufacture Google's Tensor 3 chip on its third-generation 4nm process node, and the rumored Exynos 2400 SoC may also be manufactured on the 4nm process.

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