Silicon Labs Announces the Launch of Next-Generation and Third-Generation Wireless Development Platforms
【Lansheng Technology Information】On August 22, Silicon Labs announced the launch of their next-generation and third-generation chips designed for embedded Internet of Things (IoT) devices at its fourth annual Works With developer conference. Wireless development platform. With the migration to the 22-nanometer (nm) process node, the new Silicon Labs third-generation platform will deliver industry-leading computing power, wireless performance and energy efficiency, and the highest level of IoT security built into a chip.
"Our third-generation wireless development platform is built for a more connected world that requires development flexibility and pushes more intelligence to the edge," said Matt Johnson, CEO of Silicon Labs. "The third-generation platform not only meets the needs of developers and device manufacturers today, but is built to meet their needs for the next 10 years."
Silicon Labs Simplicity Studio 6 Enhances Developer Tools with Support for Visual Studio Code
Silicon Labs continues to invest in the developer experience for customers, including documentation, cooperation with external tool vendors, and integration of new plug-ins and extensions into existing software development kits (SDKs). In addition to the third-generation hardware, Silicon Labs today announced Simplicity Studio 6, the latest version of its award-winning application development and productivity enhancement tools. Simplicity Studio 6 will bring the latest development tools to Silicon Labs' complete product portfolio, including first- and second-generation platforms, and provide developers with a bridge to third-generation platforms.
Additionally, as a support partner in the development process, Silicon Labs today announced an expanded Developer Journey tool for Amazon Sidewalk and a new Matter Development Journey tool. Both are built on the power of Silicon Labs, providing the tools, documentation, hardware, and expert support needed to develop with both technologies.
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